Display substrate and manufacturing method thereof, and display device

US12268079B2 · kind B2 · utility

Assignee

• BOE Technology Group Co., Ltd. · CN

Inventors

• Li Sheng Liu · Nanhu, CN
• Junbo WEI · Beijing, CN
• Pengcheng Lu · Beijing, CN
• Shengji Yang · Beijing, CN
• Kuanta HUANG · Beijing, CN
• Rongrong Shi · Beijing, CN
• Yuanlan TIAN · Beijing, CN
• Dacheng Zhang · Beijing, CN

Key dates

• Filing date: Feb 3, 2021
• Grant date: Apr 1, 2025
• Expiry date: Mar 22, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K2102/351

Abstract

A display substrate includes: a wafer base (1) provided with a transistor; a metal reflective structure (2) on the wafer base, the metal reflective structure being electrically connected to the transistor, and being provided with a protrusion (21) protruding away from the wafer base; a first insulation layer (3) on a side of the metal reflective structure away from the wafer base, a surface of a portion of the first insulation layer corresponding to the metal reflective structure and facing away from the metal reflective structure being flush with a top face of the protrusion; and a transparent anode (4) on a side of the first insulation layer facing away from the metal reflective structure, the transparent anode being in contact connection with the top face of the protrusion.