Multilayer resin substrate and method for producing same
US12269238B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2022 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Sep 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer resin substrate includes resin layers that are laminated, a first copper foil on the resin layers and including first and second main surfaces having first and second surface roughnesses, respectively, and a second copper foil on the resin layers and including third and fourth main surfaces having third and fourth surface roughnesses, respectively. A distance between the first main surface and the second copper foil is shorter than a distance between the second main surface and the second copper foil. When the first, second, third, and fourth surface roughnesses are denoted as SR1, SR2, SR3, and SR4 respectively, a relationship SR1<SR3≤SR4<SR2 is satisfied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.