Molding compound containing polyether block amide (PEBA)

US12269923B2 · kind B2 · utility

Assignee

• Evonik Operations GmbH · DE

Inventors

• Franz-Erich Baumann · Schneverdingen, DE
• Kathrin Salwiczek · Recklinghausen, DE
• Alexander Richter · Johannesweg, DE

Key dates

• Filing date: Oct 9, 2019
• Grant date: Apr 8, 2025
• Expiry date: Jul 25, 2041

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08J2377/00
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A molding compound contains polyether block amide (PEBA) based on a subunit 1 made of at least one linear aliphatic diamine having 5 to 15 C atoms and at least one linear aliphatic or aromatic dicarboxylic acid having 6 to 16 C atoms. The PEBA also contains a subunit 2 made of at least one polyether diol having at least 3 C atoms per ether oxygen and primary OH groups at the chain ends. The sum of the C atoms of diamine and dicarboxylic acid is odd and is 19 or 21, and the number-average molar mass of the subunit 2 is 200 to 900 g/mol. A molded object can be created from the molding compound, which can be a molded part, a film, a bristle, a fiber, or a foam.