Composite film, encapsulating structure of the same, and encapsulation method
US12269975B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Apr 27, 2023 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Aug 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composite film includes a first thermoplastic elastomer film layer and a second thermoplastic elastomer film layer, wherein the first thermoplastic elastomer film layer includes a first styrenic block copolymer. The second thermoplastic elastomer film layer is disposed on the first thermoplastic elastomer film layer, wherein the second thermoplastic elastomer film layer includes a second styrenic block copolymer, diffusion particles dispersed in the second thermoplastic elastomer film layer, and a surface microstructure disposed on the surface of the second thermoplastic elastomer film layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.