Spherical inorganic particles having surface bumps formed thereon, and method of manufacturing same
US12269983B2 · kind B2 · utility
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4References
12Claims
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Key dates
| Filing date | Feb 26, 2021 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Feb 13, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01P2006/40
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The inorganic particle according to the present invention is composed of aggregation of crystalline and amorphous small particles and has a spherical and smooth surface. The spherical appearance, low crystallinity and narrow particle size distribution of inorganic particle are more advantageous in reducing scratch defects in the CMP process. In addition, since the small particles on the surface of the inorganic particle provide more active sites, the inorganic particle has an excellent removal rate, so it is advantageous as a next-generation CMP abrasive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.