Optical interconnects using microLEDs
US12271046B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Mar 7, 2023 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Mar 7, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12104
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.