Coreless electronic substrates having embedded inductors
US12272484B2 · kind B2 · utility
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21Claims
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Key dates
| Filing date | Mar 4, 2021 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Jul 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/086
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An inductor can be formed in a coreless electronic substrate from magnetic materials and/or fabrication processes that do not result in the magnetic materials leaching into plating and/or etching solutions/chemistries, and results in a unique inductor structure. This may be achieved by forming the inductors from magnetic ferrites. The formation of the electronic substrates may also include process sequences that prevent exposure of the magnetic ferrites to the plating and/or etching solutions/chemistries.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.