Apparatus and methods for determining fluid dynamics of liquid film on wafer surface
US12272576B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2021 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Jun 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for inspecting a semiconductor substrate includes a rotatable base configured to support a substrate, and a nozzle arm includes a nozzle and a light monitoring device. The light monitoring device includes a laser transmitter and an array of light sensors arranged in the nozzle arm and facing the substrate. The light monitoring device is configured to transmit a laser pulse towards the substrate, wherein the laser pulse impinges on the substrate, receive a reflected laser pulse from the substrate, calculate whether one or more light sensors received the laser pulse, and calculate a distance between the light monitoring device and the substrate using the turnaround time for determining a process quality on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.