Semiconductor device with identification structure, method for manufacturing and tracing production information thereof
US12272643B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 19, 2022 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Sep 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54486
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device with an identification structure is provided. The semiconductor device includes a substrate and a metallization structure over the substrate. The metallization structure includes an interconnection region having a plurality of metal layers and an identification region isolated from the interconnection region. The identification region has an identification structure leveled with one of the metal layer. The identification structure includes at least one exposing recess and at least one exposing fuse. A method for manufacturing a semiconductor device with an identification structure and a method for tracing a production information of a semiconductor device are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.