Semiconductor integrated circuit and signal processing device
US12273222B2 · kind B2 · utility
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2References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2022 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | May 31, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L25/0264
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit including a waveform shaping circuit is provided. The waveform shaping circuit receives a signal. The waveform shaping circuit operates with a first inductance value in a first period. During the first period, a rising edge or a falling edge of a waveform of the signal is enhanced. The waveform shaping circuit operates with a second inductance value in a second period. During the second period, the rising or falling edges of the waveform is not enhanced. The first inductance value is larger than the second inductance value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.