Image sensor package and camera device comprising same
US12273605B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2021 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Sep 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image sensor package, according to one embodiment of the present invention, comprises: a printed circuit board; an image sensor disposed on the printed circuit board; a first support part disposed on the image sensor; a filter layer disposed on the image sensor; a second support part disposed on the printed circuit board, to the side of the image sensor; a wire part which is disposed between the first support part and the second support part, and of which one end is connected to the image sensor and the other end is connected to the printed circuit board; and a molding member filling the gap between the first support part and the second support part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.