Multilayer substrate module with filter function
US12273994B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2022 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | May 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.