Package structure
US12274102B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 5, 2021 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Nov 17, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
Abstract
A package structure is provided. The package structure includes a substrate, an electrode layer, a lighting unit, a wall, and a package compound. The substrate and the wall that is disposed on the substrate jointly define an accommodating space. The lighting unit in the accommodating space and is electrically connected to the electrode layer disposed on the substrate. The package compound covers the electrode layer, and the lighting unit. The package compound includes an attaching portion disposed on a top surface of the lighting unit and a surrounding portion that is arranged around the attaching portion. The surrounding portion has an annular slot arranged on a top surface thereof. A bottom end of the annular slot is located at a position aligning with 25%˜90% of a thickness of the lighting diode along a height direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.