Leadframe, bracket and LED device
US12274105B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2019 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Jul 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are a leadframe, a bracket and an LED device. The leadframe includes a first photo-etched metal part, having a first electrode and a chip placement layer thereon, which has a greater length for short and long edges than those of the first electrode; and a second photo-etched metal part, composed of a second electrode and a connection layer thereon, which has a greater length for short and long edges than those of the second electrode; wherein a first long edge of the chip placement layer is flush with a first long edge of the first electrode, and a first long edge of the connection layer is flush with a first long edge of the second electrode; and wherein the chip placement layer and the connection layer are provided with L-shaped pins at corners of their first long edges to cover sidewalls of the corresponding corners.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.