Patent · US Active

Method and device for processing a workpiece

US12275086B2 · kind B2 · utility

0Cited by

7References

15Claims

0Family size

Assignee

TRUMPF Werkzeugmaschinen SE + Co. KG · DE

Inventors

Manuel Kiefer · Sinsheim, DE
Christoph Bloemker · Stuttgart, DE
Uwe Mienhardt · Ditzingen, DE
Jens Ottnad · Karlsruhe, DE
Leonie Felica Tatzel · Strohberg, DE
Korbinian Weiss · Ditzingen, DE

Key dates

Filing date	Apr 1, 2021
Grant date	Apr 15, 2025
Priority date	—
Expiry date	Jul 12, 2043

Classification

Technology area (CPC G)Physics
CPC primaryG05B2219/45041
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for processing a workpiece with a laser cutting machine includes reading out a machine parameter and a material parameter and outputting a process parameter recommendation. The process parameter recommendation is created by a process parameter algorithm with at least one data aggregation routine based on a plurality of cut edge quality features. The method further includes generating a cut edge by laser processing the workpiece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.