Laser cutting systems and methods
US12275092B2 · kind B2 · utility
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4References
8Claims
0Family size
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Key dates
| Filing date | May 14, 2019 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Mar 17, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and systems for laser cutting of components are disclosed herein. Examples are specifically suited for laser cutting relatively large components of e.g. a vehicle framework such as a unitary side panel of a vehicle door. Multiple robots may perform laser cutting operations substantially simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.