CMP polishing pad with window having transparency at low wavelengths and material useful in such window
US12275116B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2020 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Aug 22, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The polishing pad is useful in chemical mechanical polishing. The polishing pad includes a polishing portion having a top polishing surface and a polishing material. There is an opening through the polishing pad and a transparent window within the opening. The transparent window is secured to the polishing pad. The window includes a polyurethane composition formed by reacting, in the presence of a hard segment inhibitor for reducing size of hard segment domains, a polymeric polyol, a polyisocyanate and a curing agent. The curing agent includes three or more hydroxyl groups forming hard segments and the polyurethane composition is an amorphous mixture of hard segments in a soft segments matrix and is free of carbon-carbon double bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.