Method for solving bright line scratched during lifting of large-size silicon wafer
US12275164B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 12, 2024 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Mar 12, 2044 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for solving a bright line scratched during lifting of a large-size silicon wafer comprises the steps of tooling preparation, crystal bar bonding, lifting preparation, and lifting. By optimizing and adjusting a lifting process, using a hollow plastic board and adding line-cutting fluid during lifting, the line-cutting fluid is attached to a diamond wire saw, which reduces the surface friction of the diamond wire saw, and improves lubricity. Furthermore, by adjusting the lifting process, lifting speeds varies due to different adsorption forces at different positions, so the diamond wire saw is prevented from scratching the surface of the silicon wafer, and the problem of scratching the bright line on the surface of the silicon wafer during lifting of the large-size silicon wafer is solved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.