Thermal donor laminate formulation and thermal donor elements comprising the same
US12275262B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2020 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Jan 25, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Described herein are embodiments of thermal donor laminate formulations and thermal transfer donor elements comprising the same. Thermal donor elements described herein can be used to transfer the laminate onto thermal receiver elements using thermal transfer means to create a transparent, protective overcoat film. In certain embodiments, the laminate is formulated without colloidal silica. Laminate formulations comprise appropriate solvent packages to account for the removal of colloidal silica, including, in some embodiments, solvent packages that do not include DEK. Certain embodiments described herein exhibit advantageous performance characteristics, such as avoiding and/or mitigating flash, satin back transfer, and print artifacts, and resist scratches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.