Negative thermal expansion material, method for producing the same, and composite material
US12275646B1 · kind B1 · utility
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16Claims
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Key dates
| Filing date | Feb 22, 2023 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Feb 22, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide a negative thermal expansion material having better negative thermal expansion characteristics. The present invention is a negative thermal expansion material, comprising a copper vanadium composite oxide dissolving Li atoms and represented by the following general formula (1):(CuxMy)(VaPb)Ot. In the general formula (1), M represents a metallic element with an atomic number of 11 or more other than Cu and V, 1.60≤x≤2.40, 0.00≤y≤0.40, 1.60≤a≤2.40, 0.00≤b≤0.40, 5.00≤t≤9.00, 1.60≤x+y≤2.40, and 1.60≤a+b≤2.40.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.