Method of treating a substrate surface, apparatus therefor, and treated glass articles
US12275666B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2021 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Aug 8, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2218/34
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Apparatus and method for treating a substrate, for example texturing a substrate. In some embodiments, a masking material is applied to a surface of the substrate in a predetermined pattern, the surface thereafter contacted with an etchant that removes the masking material. Contacting the surface with the etchant produces multiple co-located textures. In other embodiments, the masking step can be eliminated, and the etchant is applied in a predetermined pattern to produce multiple co-located textures. In still other embodiments, the substrate has a chemical composition, and the substrate is exposed to a leachant that leaches at least one constituent of the chemical composition to produce a substrate with a varying chemical composition at the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.