Curable composition, film forming method and article manufacturing method
US12275854B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2022 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Feb 22, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2025/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c), wherein the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C., a content of the solvent (d) with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent (d) at normal pressure is less than 250° C., and the polymerizable compound (a) contains a compound (a-1) containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.