Display panel having support structures being formed in via holes of the interlayer insulating layer
US12276890B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2022 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Mar 30, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13439
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
At least one embodiment of the present disclosure provides a display panel, and the display panel includes: a first substrate and a second substrate oppositely combined with each other, the first substrate includes a base substrate, and a gate line, a first electrode, a first interlayer insulating layer, and second electrode on the base substrate; the first interlayer insulating layer includes a first via hole penetrating through the first interlayer insulating layer, the second electrode is electrically connected to the first electrode the first via hole, first support structure is provided in a region corresponding to the first via hole and on a side of the second electrode away from the base substrate; at least a part of the first support structure is located in the first via hole, an orthographic projection of the first via hole overlaps with an orthographic projection of the gate line on the base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.