Characterization and use of hardware bundles
US12277426B2 · kind B2 · utility
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4References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 25, 2023 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Jan 10, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F9/44505
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and devices for providing computer implemented services using managed systems are disclosed. To provide the computer implemented services, hardware components may be bundled into hardware bundles. The hardware bundles may be used to satisfy subscriptions for the services, and limit use of the hardware bundles when subscription limits are reached. The hardware bundles may include direct management hardware components and indirect management hardware components. The performance of the hardware bundles may be characterized to facilitate future selection for use of the hardware bundles in various processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.