Multilayer electronic component
US12278052B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2023 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Aug 23, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/785
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a body including a dielectric layer including a plurality of dielectric grains and internal electrodes alternately disposed with the dielectric layer in a first direction and external electrodes disposed on the body, wherein at least one of the plurality of dielectric grains has a core-shell structure including an inner core and a shell covering at least a portion of the core, a ratio of an average size of the core to an average size of the dielectric grains having the core-shell structure is 0.4 or more and 0.8 or less, a ratio ((Dy+Tb)/Sn) of the sum of the moles of dysprosium (Dy) and the moles of terbium (Tb) to the moles of tin (Sn) included in the dielectric layer satisfies 0.7 or more and 1.5 or less, and at least one of the dielectric layers has four or more dielectric grains in the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.