Chip cooling platform based on micro-nano structure
US12278164B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2024 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Dec 11, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/427
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure discloses a chip cooling platform based on micro-nano structure, including a platform body, a cooling pipeline and an outer heat dissipation device, where the cooling pipeline is in a closed-loop structure, and part of the cooling pipeline is arranged in the platform body; the cooling pipeline is filled with cooling medium, and an inner wall of the cooling pipeline located in the platform body is provided with a turbulence structure; and a unidirectional hydraulic pump I is installed on the cooling pipeline arranged outside the platform body; the outer heat dissipation device is used for radiating the cooling medium in the cooling pipeline.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.