LED chips and devices with textured light-extracting portions, and fabrication methods
US12278219B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2021 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | May 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Pixelated-LED chips include substrate sidewalls with sidewall involutions and/or increased sidewall surface area regions to affect light extraction therefrom. A LED lighting device incorporates a superstrate that supports lumiphoric material and includes sidewalls with sidewall involutions and/or increased sidewall surface area regions. Methods for fabricating sidewall features may include etching (e.g., deep etching) of substrate or superstrate materials, such as by using an etch mask having edges with non-linear shapes to produce and/or enhance sidewall involutions when an etchant is supplied through the etch mask to selectively consume substrate or superstrate material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.