Thin film obscurant for microelectronics
US12278255B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 11, 2021 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | May 17, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8067
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for an assembly having a first wafer including bulk material and a layer having microelectronics and a wafer with a deposited thin film which is bonded to the first wafer such that the reflected film is embedded within the composed assembly. The reflector wafer can include a handle wafer and a thin film having reflectance characteristics to prevent imaging of the microelectronics via light through the bulk material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.