Radio-frequency module and communication apparatus
US12278425B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2023 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Oct 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/175
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio-frequency module includes a first base made of a first semiconductor material; a second base that is made of a second semiconductor material having a thermal conductivity lower than that of the first semiconductor material and which includes a power amplifier circuit; a third base including a transmission filter circuit; and a module substrate having a main surface on which the first base, the second base, and the third base are arranged. The first base is joined to the main surface via an electrode. The second base is arranged between the module substrate and the first base in a sectional view and is joined to the main surface via an electrode. At least part of the first base is overlapped with at least part of the second base and at least part of the third base in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.