Head part of an implantable device, method for producing the head part as well as a plug assembly which can be fitted into the head part
US12278452B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2021 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Jun 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/12
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention pertains to a head part of an implantable device, its method of production and a plug assembly which can be fitted into the head part. The head part comprises a head part housing which has at least one blind hole plug contact socket with a socket opening and a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable seal ring is positioned and which are enclosed by a solidified casting compound, are joined together in a coaxial arrangement and in an axially serial sequence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.