Optical transceiver including heat dissipation components thermally coupled to opposite sides of housing
US12279360B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2022 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Apr 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20445
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An optical transceiver includes housing, circuit board, first heat source, second heat source, first heat conductive component and second heat conductive component. The housing includes a first housing and a second housing that are stacked on each other and together form an accommodation space. The circuit board is disposed in the accommodation space. The first heat source and the second heat source are disposed on and electrically connected to the circuit board. The first heat conductive component is disposed in the circuit board and thermally coupled to the first housing. A part of the circuit board is located between the first heat conductive component and the first heat source. The second heat conductive component is disposed on the circuit board. The second heat source is thermally coupled to the second heat conductive component. The second heat conductive component is thermally coupled to the second housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.