Hybrid through hole for solid state intrusion detection
US12279370B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2022 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Jul 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0208
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw is in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.