Simultaneous pattern-scan placement during sample processing
US12280444B2 · kind B2 · utility
0Cited by
7References
14Claims
0Family size
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Key dates
| Filing date | Nov 30, 2023 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Nov 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J49/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A laser ablation system, and method, facilitates the execution of user-defined scans (i.e., in which a laser beam is scanned across a sample along a beam trajectory to ablate or dissociate a portion of the sample) and enables the user define additional scans while a scan is being executed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.