Reformable epoxy resin for composites
US12280582B2 · kind B2 · utility
0Cited by
62References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2023 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Jul 15, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF41H5/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention contemplates a method for forming a composite structure including a plurality of rigid layers and one or more reformable epoxy resin layers. The resulting composite is molded to form a non-planar composite structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.