Binding compound based on furan resin, reducing sugar and/or non-reducing sugar
US12281041B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Dec 19, 2019 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | May 14, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2218/112
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A binding compound for mineral or organic fibres, includes from 40 to 95 wt % of furan resin, and from 5 to 60 wt % of at least one reducing sugar and/or of at least one non-reducing sugar, relative to the total dry weight of the composition, the binding composition having a dry matter content between 0.5 to 50 wt %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.