Structure for simulating a thermal image
US12281944B2 · kind B2 · utility
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4References
19Claims
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Key dates
| Filing date | Jul 18, 2019 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Dec 12, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/53
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A structure (10) for simulating a thermal image generated by a real world object, the structure (10) comprising a body (22), (24), (26) and (28) having at least one cavity (106), and at least one inlet opening into the cavity (106) for receiving a flow of fluid medium into the cavity (106). The fluid medium having a temperature that differs from ambient. The cavity (106) having internal configurations defining flow paths for the fluid medium to cause temperature variations on an external surface (26) of the body to simulate the thermal image of the real world object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.