Sensor package and system

US12282075B2 · kind B2 · utility

Assignee

• Allegro MicroSystems, LLC · US

Inventors

• Simon E. Rock · Heidelberg, DE
• Georges El Bacha · Manchester, US
• Shaun D. Milano · Dunbarton, US
• Loïc André Messier · Broisin, FR
• Alexander Latham · Harvard, US
• Maxwell McNally · Manchester, US
• Shixi Louis Liu · Milpitas, US

Key dates

• Filing date: Jul 1, 2022
• Grant date: Apr 22, 2025
• Expiry date: Sep 20, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10151
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.