Ceramic electronic device having a copper-containing baked electrode layer
US12283430B2 · kind B2 · utility
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Key dates
| Filing date | Aug 24, 2022 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Aug 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A ceramic electronic device includes an element body including a ceramic layer and an internal electrode layer, and an external electrode formed on an end surface of the element body and electrically connected to at least one end of the internal electrode layer. The external electrode includes a baked electrode layer. The baked electrode layer includes a main component comprising copper and/or a copper alloy. The baked electrode layer includes a void. An inner wall surface defining the void is at least partly covered by a film comprising nickel and/or a nickel alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.