Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same
US12283490B1 · kind B1 · utility
0Cited by
64References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2023 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Dec 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/473
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a device package. The method comprises patterning a first substrate to form patterned regions comprising a thermal oxide layer. The method further comprises directly bonding the patterned regions of the first substrate to a second substrate to form a bonding interface. The bonded first and second substrates form an integrated cooling assembly comprising a coolant chamber volume. Portions of the first substrate exposed to the coolant chamber volume comprise a native oxide layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.