Semiconductor packages
US12283555B2 · kind B2 · utility
0Cited by
31References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2018 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Aug 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package is disclosed. The package includes a carrier that comprises a first conductive layer on a first side and a second conductive layer on a second side opposite the first side. The first conductive layer comprises wire bonding pads. The package also includes a semiconductor die that is flip chip mounted on the first side of the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.