Thermal plasma processing apparatus
US12284746B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2020 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Aug 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H2245/10
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present disclosure relates to a thermal plasma processing apparatus capable of efficiently using thermal plasma and securing a reaction time for the thermal decomposition of the processing gas. A Thermal plasma processing apparatus according to an embodiment of the present disclosure includes a torch part in which an arc is generated between a negative electrode and a positive electrode, and in which a processing gas to be thermally decomposed by the arc is injected between the negative electrode and the positive electrode, a power supply part configured to be connected to the negative electrode and the positive electrode and to apply a high voltage between the negative electrode and the positive electrode, and a reaction part configured to communicate with the torch part and to generate turbulence in the processing gas passing through the torch part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.