Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate
US12284766B2 · kind B2 · utility
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3References
18Claims
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Key dates
| Filing date | Jun 28, 2021 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Jun 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.