Conformal coating blockage by surface-mount technology solder features
US12284769B2 · kind B2 · utility
0Cited by
16References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 27, 2019 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Mar 18, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conformal coating control method includes arranging at least one conformal control surface feature on a surface of a printed circuit board proximate perimeter pads of an integrated circuit. The method also includes soldering, to the printed circuit board, the integrated circuit. The method also includes applying a conformal coating material to the printed circuit board, wherein the conformal coating material is at least partially restricted from flowing between the integrated circuit and the printed circuit board by solder flux residue accumulated proximate the conformal control surface feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.