Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

US12284793B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Ritu Bawa · Kanchinakote, IN
• Ruander Cardenas · Hillsboro, US
• Kathiravan D · Kanchinakote, IN
• Jia Yan Go · Kulim, MY
• Chin Kung GOH · Merang, MY
• Jeff Ku · Taipei, TW
• Prakash Kurma Raju · Kanchinakote, IN
• Baomin Liu
• Twan Sing Loo · Kampung Bukit Kechil, MY
• Mikko Makinen · Santa Clara, US
• Columbia Mishra · Hillsboro, US
• Juha Paavola · Hillsboro, US
• Prasanna Pichumani · Kanchinakote, IN
• Daniel J. Ragland · Sherwood, US
• Kannan G. Raja · Beaverton, US
• Khal Ern See · Batu Gajah, MY
• Javed Shaikh · Kanchinakote, IN
• Gokul V. Subramaniam · Bengaluru, IN
• George Baoci SUN · Folsom, US
• Xiyong TIAN · Beijing, CN
• Hua Yang · Tracy, US
• Mark Carbone · Verplanck, US
• Vivek Paranjape · Hillsboro, US
• Nehakausar Shaikh Ramjan Pinjari · Kanchinakote, IN
• Hari Shanker Thakur · Kanchinakote, IN
• Christopher Michael Moore · Racine, US
• Gustavo Fricke · San Jose, US
• Justin Huttula · Portland, US
• Gavin Sung · Taichung, TW
• Sammi Wy Liu · Taipei, TW

Key dates

• Filing date: Dec 23, 2020
• Grant date: Apr 22, 2025
• Expiry date: Dec 23, 2040

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P80/10
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.