Method of machining brittle materials
US12285811B2 · kind B2 · utility
0Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2017 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Dec 2, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23C2226/27
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of cutting (e.g. micro-milling) brittle materials where a protective ductile layer is present on the brittle material during the cutting step. The method offers an improved edge quality of the machined profile relative to previous cutting (e.g. micro-milling) techniques. A machined product obtained by or obtainable by this method is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.