Abrading with an abrading plate
US12285844B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2019 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Nov 19, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of abrading the surface of a workpiece is disclosed. The method includes providing a workpiece, an abrading apparatus with a backing pad configured to receive an abrading plate, an abrading plate attachable to the backing pad and a slurry including abrasive grains; attaching the abrading plate to the backing pad; providing the slurry including abrasive grains between the abrading plate and the surface of the workpiece; and operating the abrading apparatus to abrade the surface of the workpiece. Therein, the abrading plate includes a workpiece-facing layer, which workpiece-facing layer faces the surface of the workpiece and includes a metal or a polymer, and the abrasive grains have a hardness on the Mohs scale of greater than 5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.