Butyl rubber based pressure sensitive adhesives
US12286563B2 · kind B2 · utility
0Cited by
20References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2020 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | May 31, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2467/005
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided herein are butyl rubber based pressure sensitive adhesive compositions comprising low molecular weight polyisobutylene oligomers and a multifunctional crosslinker. These adhesive compositions can exhibit high adhesion and shear resistance without requiring curing at high temperature to provide the compositions with these advantageous performance properties. Also provided are adhesive tapes and methods using the disclosed adhesive compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.