Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same
US12286564B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
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Key dates
| Filing date | May 8, 2020 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Jan 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.