Patent · US Active

Phased array LiDAR transmitting chip of mixed materials, manufacturing method thereof, and lidar device

US12287432B2 · kind B2 · utility

0Cited by
0References
14Claims
0Family size

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Key dates

Filing dateSep 30, 2020
Grant dateApr 29, 2025
Priority date
Expiry dateFeb 29, 2044

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B2006/12164
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

The present disclosure provides a phased array LiDAR transmitting chip of mixed materials, a manufacturing method thereof, and a LiDAR device. The phased array LiDAR transmitting chip of mixed materials includes: a first material structure layer and an SOI silicon waveguide structure layer, the first material structure layer is optically connected to the SOI silicon waveguide structure layer through a coupling connection structure; the first material structure layer is configured to couple input light into the chip; the coupling connection structure is configured to split a light wave coupled to the chip, and couple each of split light waves into a corresponding silicon waveguide in the SOI silicon waveguide structure layer; where a non-linear refractive index of the first material in the first material structure layer is lower than a non-linear refractive index of silicon material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.