Phased array LiDAR transmitting chip of mixed materials, manufacturing method thereof, and lidar device
US12287432B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Feb 29, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12164
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides a phased array LiDAR transmitting chip of mixed materials, a manufacturing method thereof, and a LiDAR device. The phased array LiDAR transmitting chip of mixed materials includes: a first material structure layer and an SOI silicon waveguide structure layer, the first material structure layer is optically connected to the SOI silicon waveguide structure layer through a coupling connection structure; the first material structure layer is configured to couple input light into the chip; the coupling connection structure is configured to split a light wave coupled to the chip, and couple each of split light waves into a corresponding silicon waveguide in the SOI silicon waveguide structure layer; where a non-linear refractive index of the first material in the first material structure layer is lower than a non-linear refractive index of silicon material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.