Method for manufacturing a combined touch and force sensor, particularly backlit
US12287932B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 25, 2024 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Jul 25, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04105
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention is about a sensor assembly comprising, on an active part (621, 622), an assembly of conductive nanoparticles (560) in an insulating ligand, a substrate on which conductive tracks (611, 612, 613, 650, 651) and the assembly of nanoparticles are deposited, a thin stiffener (630) extending under the active part, glued to the substrate by a hardening glue on a first face of the thin stiffener and a pressure-sensitive adhesive attached to a second face of the thin stiffener (630), opposite the first face, configured for bonding the miniature sensor to a surface to be functionalized. The invention also relates to a method for manufacturing of such a sensor assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.